Reviews Heatsinks Memory

Xbox 360 RAM Heatsinks (4 pcs) for HANA ANA Southbridge RAM Chips - Upgrade Cooling Repair - Prevent RROD

  • 100% brand new Xbox 360 RAM Memory Heatsinks.
  • Prevent RROD and E74 error codes with extra/upgraded RAM cooling.
  • Reduce the temperature of the RAM memory chips by up to 35%.
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G.Skill Ripjaws V Series 16GB 4 x 4GB 288-Pin DDR4 SDRAM 3000 PC4 24000 Intel X99 Platform Memory F4-3000C15Q-16GVR

  • DDR4 memory upgrade designed for Intel Z170 / X99 chipsets (Skylake LGA 1151 / LGA 2011-3 CPU).
  • 16GB Quad Channel memory kit - four matched 4GB modules.
  • Full timings of CL15 (15-15-15-35) at 1.35V.
  • PC4-24000 specification, rated to run at speeds up to 3000MHz.
  • 288-pin DDR4 memory, equipped with G.Skill Ripjaws V Red Heatsinks for improved heat dissipation.
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G.Skill 16GB Dual Channel Kit 3200MHz DDR4 Trident Z Desktop Memory F4-3200C16D-16GTZB

  • Trident Z is the latest high-performance DDR4 range from G.Skill, designed for gaming and overclocking.
  • Optimized for the latest 6th Generation Intel Core Processors and Z170 chipsets.
  • Two matched 8GB modules, designed for use in dual channel setup.
  • 3200MHz memory speed with full memory timings of CL16-18-18-38 at 1.35V.
  • Luxury two-colour heatsinks with a new fin design for more effective heat dissipation.
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ASUS ROG Strix H370-F Gaming LGA1151 (Intel 8th Gen) DDR4 DP HDMI DVI M.2 H370 ATX Motherboard with USB 3.1 Gen2

  • Cutting edge gaming motherboard: with AMD AM4 socket, it is a perfect pairing for Zen 3 Ryzen 5000 & 3rd Gen AMD Ryzen CPUs.
  • Faster memory: 4 memory slots support dual channel DDR4 memory up to 128 GB, with ASUS OptiMem enabling higher memory frequencies and lower latencies.
  • Blazing data transmission speeds: Two M.2 slots, including the latest PCIe 4.0, provide maximum storage flexibility and the fastest data speeds available via the 3rd Gen AMD Ryzen platform.
  • High-performance gaming networking: Onboard WiFi 6 (802.11ax) and 2.5 Gb Ethernet for exceptionally fast and smooth online gaming experiences.
  • Optimized thermal solution: Customizable fanless VRM and chipset heatsinks with ASUS Stack Cool 3+ design keep your system running reliably.
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GIGABYTE Z590 AORUS ELITE (LGA 1200/ Intel Z590/ ATX/ Triple M.2/ PCIe 4.0/ USB 3.2 Gen2X2 Type-C/ 2.5GbE LAN/ Gaming Motherboard)

  • Supports 11th and 10th Gen Intel Core Series Processors.
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs.
  • Direct 12-plus-1 Phases Digital VRM Solution with 60A DrMOS.
  • Shielded Memory Routing for Better Memory Overclocking.
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks.
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MAXSUN Terminator B660 LGA 1700(Intel 12th Gen) mATX Motherboard (PCIe 4.0, DDR4,3xM.2 Slots, 2.5Gb LAN, DP, 2 x HDMI, VGA, Rear USB 3.2 Gen 1, Front USB 3.2 Gen 2 Type-C)

  • 【Intel LGA 1700 Socket】Supports 13th & 12th Gen Intel Core / Pentium / Celeron Processors & Windows 11 Ready.
  • 【Max Power Supply】8+1+1 Phases pure digital power supply rated for 50A Dr.MOS, premium and durable alloy chokes..
  • 【Optimized Thermal Solution】VRM heatsinks with underneath thermal pads and southbridge hollow heatsinks, providing a large contact area for MOSFETs and chokes, transfer much more heat to the heatsink..
  • 【Faster Connectivity】Dual Channel DDR4 Memory(Up to 128 GB 4*DIMMS ,MAX:5000+MHz), Ultra Durable PCIe 4.0 x16 Slot & Ultra-Fast M.2 SSD NVMe PCIe 4.0 x4 Connectors, USB 3.2, HDMI/DP/VGA, 2.5G Ethernet and 5.1 Channel HD Audio.
  • 【Quick Maintenance】Debug light-Easily checks the bug position. Clr Cmos Button-One-click recovery of security settings..
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GIGABYTE B560 AORUS PRO AX (LGA 1200/ Intel/ B560/ ATX/Triple M.2/ PCIe 4.0/ USB 3.2 Gen2X2 Type-C/Intel WiFi 6/2.5GbE LAN/Motherboard)

  • Supports 11th and 10th Gen Intel Core Series Processors.
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs.
  • Direct 12+1 Phases Digital VRM Solution with 50A DrMOS.
  • Shielded Memory Routing for Better Memory Overclocking.
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks.
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GIGABYTE Z590 AORUS ELITE AX (LGA 1200/ Intel Z590 ATX/ Triple M.2/ PCIe 4.0/ USB 3.2 Gen2X2 Type-C/ Intel WIFI 6/ 2.5GbE LAN/ Gaming Motherboard)

  • Supports 11th and 10th Gen Intel Core Series Processors.
  • Dual Channel Non-ECC Unbuffered DDR4, 4 DIMMs.
  • Direct 12+1 Phases Digital VRM Solution with 60A DrMOS.
  • Shielded Memory Routing for Better Memory Overclocking.
  • Fully Covered Thermal Design with High Coverage MOSFET Heatsinks.
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G.SKILL 16GB 2 x 8GB TridentZ Series DDR4 PC4-34100 4266MHz Memory Desktop Memory Model F4-4266C19D-16GTZA

  • Trident Z is the latest high-performance DDR4 range from G.Skill, designed for gaming and overclocking.
  • Optimized for the latest 6th Generation Intel Core Processors and Z170 chipsets.
  • Two matched 8GB modules, designed for use in dual channel setup, PC4-34100 standard.
  • Super-fast: 4266MHz memory speed with full memory timings of CL19 (19-19-19-39) at 1.4V.
  • Luxury two-colour heatsinks with a new fin design for more effective heat dissipation.
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Tempco Men's Fisherman Vest - TM209-CHARCOAL XL

  • Well Packaged - With a storage box for 102pcs heatsinks, it perfectly divides the heat sinks into 17 categories..
  • Multiple applications - It can Cool Raspberry Pi VRM VRAM CPU GPU Small IC Laptop 3D Printers Stepper Motor Modules TMC2130 TMC2100 A4988 DRV8825 TMC2208. Multiple sizes, multiple application scenarios..
  • Good heat dissipation effect - Various Aluminum and Copper heat sinks with Thermal Conductive Adhesive Tape for cooling Raspberry Pi 4 and electronics components..
  • Different Sizes - 102pcs multicolor heatsinks in different sizes contains 92pcs aluminum heatsink and 10pcs copper heatsink..
  • Package Includes: 102pcs multicolor heatsinks, 1x Storage Box..
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